Packaging Mechanical

  1. What different types of packaging are standard photodiodes offered?
  2. How do these devices are usually mounted?
  3. What are the concerns associated with exposed or open devices, such as solderable series?
  4. How can the glass windows be cleaned?
  5. What is the chip centering tolerance with respect to the OD of header?
  6. What is the rotational tolerance of the photodiode chip with respect to the header tab?


  7. 1. What different types of packaging are standard photodiodes offered?
    OSI Optoelectronics standard photodiodes are offered in three different type of packaging as well as chip only (solderable series):- Metal packages, including standard TO-18, TO-46, TO-5 and TO-8.

    - Plastic packages and

    - Mold packages

    2. How are these devices usually mounted?
    We do not recommend reflow soldering and vapor phase soldering for any of the package standard photodiodes. They can be either soldered by a soldering iron in circuit boards or sockets, or by dip soldering.

    3. What are the concerns associated with exposed or open devices, such as solderable series?
    Open or exposed devices can absorb contaminants, such as ionized molecules in water, and "short" the diode junction by increasing the dark current. Excessive care must be taken when handling open devices. Handle chips with anti-static plastic tweezers or similar items.

    4. How can the glass windows be cleaned?
    Since most of OSI Optoelectronics standard photodiodes are either silicon or quartz, they can be cleaned with isopropyl alcohol and a soft optical grade pad.

    5. What is the chip centering tolerance with respect to the OD of header?
    Our standard products are usually centered within +/- 0.010 inches.

    6. What is the rotational tolerance of the photodiode chip with respect to the header tab?
    Usually +/- 1ยบ.

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